HTK-002 Thermal paste Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds withstand changes in consistency at temperatures as much as 177 C (350 F), maintaining a positive heat sink seal to support heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device. Product Features: Suitable for CPU, chipsets on Mainboard, VGA card, and so forth. Easy to make use of Zif Socket Templates make sure that correct applying area with quite a lot of CPU socket types. Produces an even layer when the use of applicator. Dielectric. Wide selection of application temperature
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Low Thermal Resistance
High Thermal Conductivity
Electrically Non-Conductive
Package Dimensions: 2.0 L x 16.8 H x 10.4 W (centimetres)